Nanoelectronics

Technology Map Contents

February 2008

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Conventional Electronic Materials
- Wafers
- Silicon Layers
- Gallium Arsenide, Indium Phosphide, and Other III-Vs
- Materials for Quantum Confinement
- Metals and Dielectrics
- Organic Layers
- Process Chemicals and Gases
Nanoparticles
- Nanophase Materials
- Nanocomposites
Other Nanoelectronic Materials
- Carbon Nanotubes
- Polymers
- Molecular Nanoelectronic Materials
- Bioelectronic Materials and Biological Analogs
Top-Down and Bottom-Up Fabrication
Conventional Fabrication Processes
- CVD Deposition and Epitaxy
- Spin Coating
- Lithography
- Etching and Planarization
Nanoimprint Lithography
Nanoimprinting and Inking
Nanoparticle Manufacture
- Dry (Gas-Phase) Processing
- Wet (Sol-Gel) Processing and Device Manufacture
Other Atomic- and Molecular-Manufacturing Processes
- Self-Assembly Techniques
- Scanning-Probe Microscopy
- Langmuir-Blodgett Technique
- Molecular Machines
Device Design and Packaging
Basic Electronic Building Blocks, Structures, and Devices
Downscaling Issues for CMOS Devices
Solid-State Quantum-Effect Nanostructures
Hybrid Nanoelectronic Devices

Demand Factors
- Moore's Law
- Demand for Devices and Bandwidth
- Rising Fab Costs
General Constraints
- Nanotechnology Hype and Fatigue
- Long Time to Market
- Conventional Manufacturing
Synergistic Technologies
- Analysis and Inspection Tools
- Biotech/Pharmaceutical Development
- Current IC Processing
- MEMS
Competing Technologies
- MEMS
- Conventional Electronics Downscaling
Required Resources
- Long-Term Research Funding
- Industry Consortia and Access to Expertise
- Regional Development Initiatives
Regulatory Factors
- Health and Environmental Legislation for Nanoparticles
- Ethical and Social Approval