Advanced Silicon Microelectronics/ULSI

Technology Map Contents

July 2008

<<  Return to Viewpoints
  Download complete Technology Map  (PDF)

Technology Map Detailed Contents

Importance of the Technology

The Technology in Brief

• Design
  • Computer-Aided Design and Engineering
  • Logic Synthesis
  • Design for Testability
  • Mixed-Signal/Analog IC Design and Test
  • Design Verification
  • Evolvable Hardware
  • Reliability, Fault Detection, and Correction
  • Embedded Memory
  • DSP Developments
  • ASIC Developments
  • Low-Voltage Strategies
  • System-Level Integration
• Fabrication
  • Wet Chemicals in Semiconductor Processing
  • Manufacturing Strategy
  • Lithography
  • Optical Enhancement with RET
  • Immersion Lithography
  • Next-Generation Lithography
  • Etching and Deposition
  • Low-k Dielectrics
  • Rapid Thermal Processing
  • ALD and Sub-100-nm Deposition Choices
  • Mass-Removal and Planarization Methods
  • Particulates and Defects
  • Nanoelectronics
• Process Technology
• CMOS and BiCMOS
• Testing
  • Process/Fabrication Testing
  • Known Good Die
  • Memory-Chip Testing
• Packaging
  • Multichip Modules
  • Ultrathin ICs
  • Chip-Scale Packaging
  • Wafer-Level Packaging
  • The Fusion of Test and Packaging
  • Thermal Management

Commercial Development Parameters

• International Technology Roadmap for Semiconductors
• Demand Factors
  • Industry Cycles
  • Supply-Chain Dynamics
  • Silicon Supply
• Synergistic Technologies
  • New Materials for Sub-90-nm Devices
  • Silicon Photonics
  • Advanced Memory and High-k Dielectrics
  • Ferroelectric Memories
  • Future Memory Devices
  • Increasing Diversity in Memory Choices
• Competing Technologies
  • Silicon Carbide
  • Gallium Arsenide
  • Carbon Nanotubes
  • Quantum Computers
• Required Resources
  • Industry Investment
  • The Growth of Foundry Manufacturing
  • 300-mm-Wafer Production
  • Manufacturing Productivity and E-Diagnostics
• Research and Development Programs
  • U.S. Initiatives
  • European Initiatives
• Regulatory Factors

Areas to Monitor

• CMP Consumables
• China's Growth
• Scaling and Moore's Law
• Nanoelectronics
• Portable Fuel Cells
• New Memory
• Industry Cycles
• Processor Architectures
• Foundry Business
• Silicon Supply
• New Models for Chemical Suppliers
• Lithography Developments
• Low-k Developments

Implications of Commercialization

• Information Overload?
• The Electronics Future
• Electronics in the Information Age

Opportunities

• ITRS
• General Computing
  • Ubiquitous Multicore Computing
  • Multiprocessor-Programming Tools
  • Massively Multicore Computing
  • Multi-GPU and Advanced Gaming Platforms
  • GPGPU
  • NAND-SSD Mass Storage
  • Next-Generation Memory
  • Universal Memory
• Communications
  • Next-Generation Memory: Cell-Phone Flash
  • RF CMOS Single-Chip 3G
  • RF CMOS Single-Chip 4G
  • CMOS WPAN
  • CMOS RF-MEMS
• Military Electronics
  • Silicon Carbide Sensors and Electronics
  • JTRS Deployment
• Automotive Applications
  • Digital Infotainment and Navigation
  • Next-Generation Memory
  • Multicore MCUs
  • MEMS Sensors
  • Silicon Carbide Sensors and Power ICs

Players

Updates

Viewpoints Features

Abbreviations